AVP Optoelectronic Packaging Technology.

A generic optoelectronic packaging technology has been developed and demonstrated with the DLC-Rx, a cluster-of-four data-link receivers functionally equivalent to four ODL-200 Rx. This technology uses a simplified AVP flip-chip-on-silicon substrate to assemble and interconnect multiple data-link channels and/or functionalities into a high density and high performance single package. The advantages offered are: optimized capacitive, resistive, and inductive loading; minimized distance between decoupling capacitors and active circuits; self-aligned fiber insertion; and highly automated manufacturing. These advantages translate to higher functional density and performance at a lower cost over conventional optoelectronic packaging technologies. The demonstration vehicle DLC-Rx performs at -36.3 +- 0.25 dBm sensitivity while all four channels are active. This sensitivity remains constant up to 200 Mbits/sec, with the 3 dB roll-off bit rate at 220 Mbits/sec. Design information, design assistance, and substrate fabrication services are available for potential users of this technology.