Compliance of Surface Mount Component Lead Designs with Rectangular and Circular Cross Sections
11 September 1989
Circular cross-section compliant lead designs for surface mount (SM) active components is a recent packaging technology innovation. Thermo- compression (TC) bonded circular cross-section wire-leads are now used to convert SM leadless ceramic chip carriers (LCCCs) to leaded packages with improved solder attachment reliability margin on organic substrates. Through-hole mount (THM) components modified for SM assembly typically have axial leads with uniform circular cross-section.