Conclusions from Phase I IEEE Compliant Lead Task Force preliminary test results - Part II.

AT&T is one of 23 companies participating in the Compliant Lead Task Force sponsored by the Computer Packaging Committee of the IEEE Computer Society. Partial results from Phase I (the learning Phase) of the test program are reported. Plastic leaded chip carriers (PLCCs) with 68 I/0's from seven manufacturers (AMP, AT&T, Hitachi LSI, NCR, NSC, TI) have been subjected to cyclic bending at frequencies ranging from 14,400 to 72 cycles/day and temperatures from 81 to 23C. The test results indicate significant differences in the cyclic fatigue lives, and, thus, the compliancies, of the PLCC lead/attach designs for these seven PLCCs. Of these designs the AT&T design shows the best fatigue life. The differences in the fatigue life results caused by the different frequency/temperature test conditions show excellent correspondence with the predictions from the Engelmaier solder-fatigue model.