Convection and Conduction Cooling of Substrates Containing Multiple Heat Sources

T h e remarkable technologies of beam-leaded and thin film integrated circuits have resulted in a new approach to the physical design of electronic circuits. 1 This approach as shown in Fig. 1 consists of bonding beam-leaded integrated circuits to ceramic or glass substrates containing thin film components and conductors. At present, dissipation of the thermal energy generated in these circuits is one of the most severe limitations and affects both device performance and reliability. T h e results of this analysis will provide a better understanding of 1659 1664 T H E BELL SYSTEM TECHNICAL J O U R N A L , OCTOBER li)«7 Fig. 1 -- Integrated circuit substrate.