Crystalline Silicon Tilting Mirrors for Optical Cross Connect Switches
01 October 2003
This paper discusses a two-piece approach for fabricating two- dimensional arrays of tilting MEMS mirrors with application in very-large optical cross connect switches. In the new process a two-sided etching of SOI wafers is used to create crystalline mirrors on a first wafer that is later aligned and bonded to a separate wafer containing the activation electrodes, traces, and bond pads.
The approach allows a very close spacing of mirror elements and a very simple design for the mechanical structures, and also greatly simplifies wire routing.
