Design for lead-free solder joint reliability of high-density packages
01 January 2004
The lead-free solder joint reliability of several printed circuit board mounted high-density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256-pin plastic ball grid array (PBGA), a 388-pin PBGA, and a 1657-pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead-free solder joints of these packages.