Designed Experiment to Assess the Surface Mount Attachment Reliability of 14mil Pitch (1000 I/O) Underfilled DCA

To accommodate larger (>= 1000) I/O and maintain die sizes as small as practicable, the use of area array solder bump flip chip is increasingly being used to bond large ASIC and microprocessor devices to a BGA substrate. This paper presents the results of a designed experiment to assess the reliability of a 14 mil pitch, 0.45 x 0.45 1000 I/O daisy-chained area array flip-chip, assembled to an FR-4 substrate.