Ductility Determination for Rolled Annealed Copper Foil

Copper foil is used for the conductive layers of both flexible and rigid printed wiring boards. With the fatigue ductility test the ductility of metallic foils and flecible metal foil/dielectric laminates can be determined. Together with the tensile strength this allows prediction of the fatigue behavior of flexible printed wiring (FPW) in both the low-cycle/high-strain (ductility dependent) and the high-cycle/low- strain (strength dependent) ranges.