Dynamic mechanical properties of two conductive die attach epoxies.
01 January 1986
The dynamic shear moduli (both storage and loss) of two commercially available microelectronic grade silver-filled die attach epoxies were examined using a Rheometrics Dynamic Spectrometer. The time-temperature behavior of the shear moduli was characterized after normal curing (175C, 90 minutes) and extended curing (175C, 150 minutes). In addition, the normally cured samples were rerun to examine the effects of exposure to temperature experienced during the initial run (-40C to +250C) DSC (Differential Scanning Calorimetry) results were used to confirm a high degree of cure in the samples used. The two materials were compared and the results related to known stress behavior during handling and assembly.