Effect of CAPS on aluminum electromigration.
01 January 1986
The electromigration characteristics of Al-0.5%Cu films deposited by the new Varian e-Gun, installed in MOSLAB II, have been evaluated. Their electromigration resistance is an order of magnitude worse than previously reported for similarly evaporation films. In addition, the improvement associated with a decrease in line width to 1micron is not observed. Such a degradation in properties has been correlated with a more heterogenous grain structure and a loss of 111> fiber texture in the present films.