Effect of Inclusions on the Properties of Plated Films for Electronic Applications

Physical properties of electroplated and electroless-plated metals are greatly influenced by minute quantities of impurities incorporated in the deposit. In some instances, the inclusions result from organic or inorganic additives which are added in the plating solution to give desired properties to the deposit. In other instances, reaction byproducts formed during the plating are incorporated in the deposit. This lecture will review the current state of understanding of the inclusion effect for two cases of interest in electronic applications: the electrolytic plating of hard gold and the electroless plating of copper.