Electrical Characterization of PolyHIC, A High Density, High Frequency, Interconnection and Packaging Medium for Digital Circuits

AT&T has developed a family of multilayer hybrid integrated circuits called POLYHIC using film technology on an alumina substrate with triazine-based photodefinable polymer dielectric layers. This family provides high interconnection density packages with desirable electrical properties. High-frequency applications employ the capability of this package to provide a controlled impedance, low loss environment with terminations very close to the silicon devices. A program has been underway at AT&T Bell Laboratories to characterize transmission line effects for high data rate applications with this package.