Electrocodeposition of Copper and Polystyrene Latex Particles on a Rotating Disc Electrode

Electrocodeposition of copper and (0.345microns) polystyrene latex particles was studied on a rotating disc electrode (RDE). Deposition experiments were performed under galvanostatic conditions at a freshly electroplated copper surface. Electron microscopy and particle counting analysis was used to obtain deposition rates. At a constant rotation speed, the rate of particle deposition was found to be approximately constant over the range of current densities studied (1-12mA/cm sup 2). An interfacial kinetics model explains the observed rate dependence on transport conditions.