Electronic System Topology and Design

This chapter provides a theoretical and practical treatment of one of the three major electronics packaging problems: interconnection. The centerpiece of the chapter will be the mathematics, modeling, and design tools for substrate and board level wiring. Rent's Rule and various heuristic wiring models will be discussed in detail. While this book makes no attempt at a thorough coverage of CAD and CAE tools, the fundamentals of layout systems and algorithms will be presented, using an example problem to provide a practical foundation.