Electrostatic Discharge (ESD) Sensitivity of Thin Film Hybrid Passive Components

The Electrostatic Discharge (ESD) sensitivities of thin film passive components from various hybrid integrated circuits (HIC) were characterized using two models. The Human Body Model (HBM) and the Charge Device Model (CDM). It was found that thin film Au conductors made with minimum linewidth of 60microns were insensitive to ESD of 3000V. Capacitors failed HBM voltages as low as 300V when tested following the specification which calls for multiple HBM discharges. 

However, this test procedure was not indicative of the capacitors' ESD robustness due to a cumulative effect of the capacitors' ESD voltages as low as 600V, High value resistors, when not RTV (room temperature vulcanized) encapsulated, were damaged due to arching at lower ESD voltages than when encapsulated. Based on the experimental results and analysis, design rules for ESD robust low value resistors have been recommended. Also, a new meander resistor design has been proposed.