Passivity and Corrosion of Electronic Materials and Devices
01 January 1990
The electronics industry depends on the passivation of metals and semiconductors for the success of its processing technologies and the operation of its components and devices. While anodic passivation and chemical passivation, e.g., gaseous oxidation, proceed by different mechanisms, the results are frequently equivalent. In this paper, we will discuss the similarities and differences between anodic passivation and low-temperature oxidation for metals, alloys and semiconductors of importance to the electronics industry. In addition to examining anodic and gaseous oxidation, we will consider the effects of water or moisture, of aggressive anions and other contaminants, and of applied voltages on components and devices, as applicable to both methods of passivation.