RF system in packaging (SIP) technologies and its applications in modern micro base stations
23 June 2014
This paper focused on design single chip of modern micro base station RF front end (included ADCs and DACs) using the system in package (SIP) technology, the chip has features of full band coverage of one receiver, one feedback channel, and one transmitter integrated, which is integrated in two layer stack design, and focused to solve the interlayer RF signal connection, signal crosstalk in micro distance, and heat diffusion issues， which are verified successfully by the test results. And this paper also discusses the applications in design of the advanced base station of Frequency division system (FDD) and time division system (TDD) based on the chip.