Solderless Wrapped Connections: Part III - Evaluation and Performance Tests

The previous two articles have described the fundamental considerations involved in solderless wrapped connections. A description of these connections together with a rather detailed explanation of the forces which maintain them has been presented. This third article discusses the results of a number of tests where the actual fabrication and use of these connections have been simulated. From these results it will be seen that reliable performance can be expected over the central office life of these connections, and that the variations permissible in their fabrication will privide sufficient margin to make that process easy to control. GENERAL REQUIREMENTS The minimum physical requirements which a solderless wrapped connection must meet are: 1. Intimate contact between wire and terminal. 2. The points of contact should be gas-tight to withstand corrosion. 3. The minimum dimension of the gas-tight area should be great enough so that it does not decrease appreciably during the expected 591