We report on a hybrid III-V on silicon laser, fabricated by wafer-scale molecular bonding, and directly modulated at 10Gb/s for transmission over distances up to 60km.
This paper reports on recent advances on hybrid III-V on silicon integration using a wafer bonding technique.
A hybrid InP/SiN tunable laser based on microring resonators exhibiting 40mW fiber-coupled output power and 5kHz linewidth is demonstrated.
A 60 GHz transmit module comprising fibre input, high-gain MMIC amplifier, and planar antenna is presented.
We report on a 1.55 micron low chirp EA-modulated hybrid integrated wavelength selectable DFB laser array.
We demonstrate a novel wavelength-tunable hybrid silicon-based transmitter with integrated reflectivity tunable mirror.
Abstract: Optical transmission systems are increasingly using parallelism to address the gap between electronic switching speeds and required aggregate bandwidth between nodes.
A photonic integration platform is presented that allows easy manipulation and alignment of a ball lens doublet for efficient coupling between different optical components.
This paper focuses on the design and parametric numerical study of a hybrid heat sink combining a liquid thermal interface with an array of synthetic jet actuators for 3-D chip stack cooling.
We developed time-domain hybrid-modulation with adaptive symbol-rates to optimize the reach of WSS routed 400 Gb/s systems.
