Encapsulated, Magnetic-Semiconductor Device for Power Conversion Applications

We present a unified magnetic-electrical-thermal package design for a power magnetic and semiconductor manufacturing issues for use in very dense, low profile power converters. The packaged power magnetic-semiconductor device includes: (1) an isolation transformer; (2) a semiconductor switch; (3) a rectifier on the secondary side and; (4) an encapsulant surrounding the transformer, the switch and the rectifier joining them into a single integrated package. This package has the means for a thermal path to the external environment. We study the impact of this device on power density, electrical and thermal performance.