Optimization of A Highly Selective Nitride/Oxide Rie In a Batch Etching Machine By Statistical Analysis

As the feature sizes of semiconductor devices continue to shrink below one micron, the demands of process capability increase in order to maintain manufacturability. This paper describes the optimization of a two step nitride etch process in a hexode reactor by Design of Experiments and Statistical Process Control methods. Through optimization, tighter process control is achieved thus allowing a more robust process.