Applications of SIMS to Microelectronics Processing: Characterization and Problem Solving
26 May 1989
The SIMS technique is reviewed. The application of SIMS to microelectronics fabrication is demonstrated by following the processing of a silicon metal-oxide-semiconductor (MOS) structure from the silicon substrate up to deposition of a silicon nitride cap layer. Examples are presented for major process steps to show characterization of the structure and to indicate processing problems.