ICE-D Intra-Data-Center optics

Ultra low-power, scalable optical connectivity for AI intra-data-center networks

How does ICE-D technology enable intra-data-center networking?

Based on monolithic indium phosphide (InP) photonic integrated circuit (PIC) technology, ICE-D integrates multiple optical functions into a non-hermetic and uncooled solution, including:

distributed-feedback (DFB) lasers
multi-channel arrays
ultra-low-voltage Mach-Zehnder modulators (MZMs)
low-voltage electro-absorption modulators (EAMs)
photodiode arrays

The ICE-D PIC is co-packaged with a silicon-germanium (SiGe) driver that prepares electrical signals for optical conversion. ICE-D enables high-speed transmission up to 3.2 Tb/s with very low power consumption and low Vπ drive voltage requirements, helping data center operators address the exponential growth in intra-data-center connectivity driven by AI applications.

ICE-D technology enables seamless integration across a range of intra-data-center optical architectures, including DSP-based fully retimed optics (FRO), half-retimed optics (HRO), and linear-drive pluggable optics (LPO). It supports applications from 100 m to 10 km and can be deployed in both electrically and optically switched networks. It is compatible with industry-standard QSFP, OSFP, and extra-dense pluggable optics (XPO) modules.

What are the benefits of Nokia ICE-D?

Industrial scale

Up to 3.2 Tb/s scalable connectivity for the most demanding AI intra-DC interconnects, backed by a resilient supply chain and high-volume manufacturing.

Power reduction

Enabled by a monolithic InP-based PIC, ICE-D reduces intra–data-center connectivity power consumption, achieving extremely low power operation (<10W in LPO architectures).