Cofiring of High Profile Multilayer Ceramic Packages for Photonic Applications
19 October 1989
A family of high profile (>6mm) multilayer ceramic packages have been designed and developed for various optical applications. The housings have a 'window frame' architecture and extensive planear and vertical (vias) metallized patterns buried within the walls of the ceramic to support the I/O design. Hermeticity, opaqueness to external light, thermal management and dimensional control (+-1%) are additional package requirements.