Evaluation of Polyimide as a Dielectric for Advanced VLSI Packaging
24 October 1989
A condensation polyimide was evaluated to determine the effects of curing at different temperatures on chemical, electrical and physical properties. The chemical behavior of DuPont PI-2555 was examined using thermal analysis. Fourier transform infrared spectroscopy (FTIR) and pyrolysis gas chromatography/mass spectrometry (GC/MS). Electrical properties based on capacitance measurements taken at 10 sup 1 to 10 sup 7 Hz were also obtained. Adhesive strength was evaluated by using a peel test.