Fabrication of Fine-Line Resist Patterns

Proposed is a method of fabricating fine line printed circuit boards. Delamination of the photoresist is prevented by developing the resist in two stages. In the first stage, the resist is developed by standard techniques, but is stopped at a point where a thin layer connects the desired pattern. This thin layer prevents the pattern from being washed away by the developer. In the second stage, this thin layer is removed by plasma etching.