The gases of plasma etching: Silicon-based technology.
01 January 1985
The trend toward higher and higher circuit density in microcircuit pattern delineation has required the use of plasma etching for many process steps. In this article, plasma processing for silicon-based technology is reviewed in terms of the gases and gas mixtures required to selectively etch important films such as silicon, poly-silicon, oxide and nitride, metals, and organics.