Thermal Characterization of 244 Lead Hybrid Integrated Circuit
07 February 1989
A computational and experimental study was undertaken to characterize the thermal performance of a 244 lead Hybrid Integrated Circuit (HIC) mounted on a glass epoxy printed wiring board (PWB). The effects on thermal performance of a heat spreader attached to the HIC substrate and the PWB thermal conductivity were investigated for both natural and forced convection cooling.