Thick-film hybrid technology for low-output-voltage DC/DC converter

The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 V(DC)) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm(3) was obtained with high efficiency (approximately 90%).