Swetapadma Samal

Biography

Swetapadma Samal is a semiconductor engineer focused on advance computer architectures and next-generation hardware systems. She holds an M.Tech in VLSI and Embedded System Design and has over Nine years of experience spanning ASIC/SoC development, digital design, processor architectures, FPGA development, RTL implementation, verification, and silicon realization of complex digital systems.

Currently, she works as a SoC Frontend Design Engineer at Nokia Bell Labs as part of Platform and ASIC Research Lab. Her work involves SoC architecture exploration, microarchitecture development, RTL design, IP integration, and design-quality methodologies for high-performance and power-efficient silicon platforms. She collaborates closely with architecture, verification, and physical design teams to translate innovative concepts into scalable, production-ready silicon solutions. Her recent work has focused on building robust digital subsystems that support the evolving demands of intelligent networks, Neuromorphic & Edge Computing Architectures and future communication technologies. 

Prior to Nokia Bell Labs, Swetapadma worked at Thales Defense & Security, where she contributed to the design and implementation of RISC-V–based processors, vector-processing architectures, FPGA-based systems, communication IPs, and high-speed digital circuits for defense and radar applications. She also gained valuable experience in FPGA prototyping, embedded systems, hardware-software integration, and system-level debugging. Earlier in her career at Axiscades Aerospace & Technologies, she worked on digital design, verification, FPGA development, board-level integration, and aerospace electronics, building a strong foundation in complex hardware system development and engineering best practices.

Her expertise spans the complete front-end development flow, including RTL design, SoC integration, RISC-V architecture, FPGA prototyping, low-power methodologies and design verification. She is particularly interested in AI-enabled hardware architectures, advanced processor design, intelligent communication systems, energy-efficient VLSI, and future semiconductor technologies that bridge computing and connectivity.