This paper explores the use of liquid immersion and vapor condensation curing as alternatives to conventional hot air oven curing of flip chip on board underfill.
The extended fine structure (EXAFS) of the Fe K edge x-ray absorption spectrum has been analyzed for 0(2) adducts of "picket fence" iron(II) porphyrin complexes with hindered bases: Fe (0(2))(TpivP
Plasma processing damages devices by driving current through the thin gate oxides.
This article attempts to provide a set of new directions and ideas for research in the ever vibrant fields of telecom and IoT security.
The paper describes a method of trunking medium-size groups which are too large to be tandemed and too small to take advantage of large capacity switches.
This paper describes the Ka-band altimetry payload and system that has been studied for several years by CNES, ALCATEL SPACE and some science laboratories.
The ability to extract topology information from the network is important for many applications and enables more informed resource selection or application-level traffic routing.
The electrolytic condenser is formed by the immersion of aluminium in a suitable electrolyte, a thin film of oxide functioning as the dielectric.
Here we present a new tapered semiconductor optical amplifier (SOA) structure that exhibits more than 600 mW output power at a wavelength of 780 nm.
WDM amplification tests performed on highly erbium-doped fibers show that 36-dB/m fibers offer the best tradeoff to design efficient compact WDM amplifiers.
