Physical and chemical information on zinc corrosion layer formation, evolution, morphology, and chemical makeup is organized and presented, together with information on zinc-containing minerals an
Polyimides are among the most important class of polymers being considered for use as inner-layer dielectrics in multi-level metal systems or as organic passivation layers.
To determine if polyimide is an appropriate over-metal passivation dielectric for non-hermetically sealed high voltage devices, the corrosion rate of sputtered aluminum test patterns, with either p
Cu corrosion in mixed flowing gases has been widely studied.
We review the present understanding of corrosion of electronic materials and devices and indicate future directions.
Classical chemical, electrochemical, and galvanic corrosion processes, induced or assisted by ionic contamination, particularly in the presence of moisture, have often been found to cause degradati
HE intricate cable network of the telephone system offers numerous opportunities for the occurrence of corrosion.
Recently, the corrosion resistance of printed wiring board (PWB) finishes has generated considerable interest due to field failures observed in various parts of the world.
Surfaces exposed to the atmosphere receive water in several forms: adsorption of water vapor, condensation of dew and fog, and deposition of rain and snow.
The increasing number of fiber optic routes being installed leads to an increasing number of underwater installations.
