In this article, an update is presented for modern technical writing using electronic text processing.
A technique is described for bonding ultrasound transducers to materials with values of thermal expansion such that ordinary bonding methods become unusable.
Silicon-On-Insulator (SOI) technology will be needed for future generations of radiation-hardened integrated circuits.
We have developed and tested a technique for measuring the radiation response of the interface of silicon-on-insulator (SOI) materials.
We have developed two new methods for at-wavelength inspection of mask blanks for extreme-ultraviolet (EUV) lithography.
HAT radars are marvels of ingenuity has long since become common knowledge. This ingenuity is reflected, however, in complexity of circuits.
A previous paper 1 has dealt with the problem of automatic equalization for data transmission systems.
Techniques for representing the entire gray scale of a picture by only two levels have been receiving considerable attention 1 - 1 0 because many devices are limited to recording or displaying two-
Bragg reflector fabrication techniques on SiO sub 2 - Si sub 3 N sub 4 - SiO sub 2 rib waveguides on Si are developed and optimized.
This memorandum is intended as a roadmap for selecting signal processing techniques that reduce the effects of transmission impairments, and thereby provide higher data rates, improved error rates,
