Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?
08 October 1987
A simplified analytical model of hybrid-integrated-circuit (HIC)/ printed-wire-band (PWB) assembly bowing is developed to explain a paradoxical situation, observed by T.F. Marinis, R.C. Reinert and W.M. Sherry during testing of compliant leaded HIC's: the bending moments applied to the PWB and caused the HIC fracture turned out in some tests smaller for greater lead compliance.