Shielded vertical interconnection for microwave chip scale packaging

As both RF operating frequencies and digital clock rates continue to rise, package, board and connector designers will need to co-operate in order to meet the performance requirements demanded by system designers. The sub-discipline demarcation questions of the past- Is it a package? Is it a board? Is it a connector? will surely disappear. Here a new microwave package vertical connection technique is described, with simulation and measured results.