Numerous papers and texts have been written in the reliability literature regarding the determination of the optimum test duration for a production stress or a burn-in test.
Numerous papers and texts have been written in the reliability literature regarding the determination of the optimum test duration for a production stress or a burn-in test.
The stresses in periodic Mo/Si, W/Si, and Mo/C multilayer films have been determined from wafer-curvature measurements.
Superconductors in practical applications are subjected to large stresses such as caused by coil winding, thermal contraction, and the Lorentz force generated by magnetic field.
The objective of fault injection is to mimic the existence of faults and to force the exercise of the fault tolerance mechanisms of the target system.
The magnitude and the longitudinal distribution of stresses and deflections in elongated adhesively bonded bi-material assemblies are determined and analyzed.
Simple, easy-to-use, and physically meaningful analytical ({''}mathematical{''}) models are suggested for the assessment of the lattice- and thermal-mismatch stresses in bi-material semiconductor,
The contact metallization of 1000angstroms Ti followed by 1500angstroms Pt deposited by R.F.
We describe a program for assigning correct stress contours to compounds and other modifier-head structures in English.
A new class of experiments that probe folding of individual protein domains uses mechanical stretching to cause the transition.
