Understanding the reliability attributes of surface mount attachments requires, among other things, insight into the thermomechanical response of solder joints during temperature cycling.
A thermomechanical model for the mechanism of rapid degradation of AlGaAs based high power laser bars (808 nm) is presented.
This paper reports results on FEM modeling in order to calculate stress distribution at the Cu/Si boundary of TSVs after the fabrication process (annealing) using ANSYS software.
Precise thermomechanical positioning has been demonstrated in an actuator device based on a silicone elastomer with a high thermal expansion coefficient.
Density, surface tension and viscosity were measured in a LiCaAlF sub 6 melt from 815degrees to 915C.
An isotropic temperature-dependent potential (ITDP) is calculated For the description of binary interactions in gaseous tetramethylmethane, C(CH3)(4), and tetramethylsilane, Si(CH3)(4).
We study Coulomb blockade oscillations of thermoelectric coefficients of a single electron transistor based on a quantum dot strongly coupled to one of the leads by a quantum point contact.
We study Coulomb blockade oscillations of thermoelectric coefficients of a single electron transistor based on a quantum dot strongly coupled to one of the leads by a quantum point contact.
Phase separation behavior and phase morphology of mixtures of methylene dianiline (MDA)-cured diglycidyl ether of Bisphenol A (DGEBA) epoxy oligomer and 0-30 wt % of ethylene-(vinyl acetate) copoly
The use of organometallic vapor phase epitaxy (OMVPE) for the growth of Hg containing semiconductors has been hindered by lack of reproducibility and uniformity.
