Publications

1. INTRODUCTION: The thermal characteristics of a Hybrid Integrated Circuit (HIC) were studied.

A simple analytical model is developed for the prediction of the thermally induced interfacial stresses in a polymer coated glass fiber with a low modulus coating at the ends.

A polymer-coated glass fiber with a low-modulus coating at the ends is considered.

Simple physically meaningful analytical (mathematical) predictive stress models are developed for typical through-silicon-via (TSV) designs using theory-of-elasticity approach.

Large temperatures gradients and substantial differences in thermal expansion coefficients are among the major factors for thermal stress generation in many materials systems.

Differential Scanning Calorimetry (DSC) measurements were performed on a series of ethylene-vinyl chloride copolymers (E-V) prepared via reductive dechlorination of poly(vinyl chloride) with tribut

Differential Scanning Calorimetry (DSC) measurements were performed on a series of ethylene-vinyl chloride (E-V) copolymers for the purpose of studying the dependence of their thermal transitions u

The thermal motion of the atoms in Ba sub 2 YCu sub 3 O sub 7 was recently using X-ray diffraction.

Mechanical failure can result in a significant loss of electronic components during fabrication and testing, as well as during the normal operating life of the package.

We report experimental demonstration of the Kennard-Stepanov (KS) relation, a fundamental equilibrium relation determined by absolute temperature, between photoluminescence (PL) and PL-excitation s