Publications

The thermal fatigue performances of Sn(98.5)Ag(1.0) Cu(0.5) (SAC105), Sn(97.5)Ag(2.0)Cu(0.5) (SAC205), Sn(96.5)Ag(3.0)Cu(0.5) (SAC305) and Sn(95.5)Ag(4.0)Cu(0.5) (SAC405) solder alloys with Pb term

Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, milit

At the time the European Union RoHS deadline was enacted in July 2006, the industry practically had reached consensus on the use of near-eutectic Sn-Ag-Cu (SAC) solder alloys.

Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components.

This paper presents a thermal analysis of an integrated boost converter module by the finite element method.

We focus this paper on the improvement of the thermal management of power transistor based on the InGaP/GaAs HBT technology and specially for pulsed mode application.

Enhancing power efficiency and bandwidth of RF power amplifiers (PAs) is always a challenge for future mobile basestation transceivers.

This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process.

The creation, transport and storage of digital information is growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication (Internet of Things, cloud

The temperature of a thin rotating disk electrode can be modulated by the absorption of laser radiation impinging on its back, using a hollow tube design(1).