The thermal expansion of Pb sub 2 sr sub 2 Y sub (1-x) Ca sub x Cu sub 3 O sub (8+delta) has been measured between 25 and 700C for x = 0, .2 and .4.
The thermal expansion of Y(2)SiO(5) crystals has been measured for three principal crystallographic directions and for two orthogonal directions in the (101) plane.
The thermal fatigue performances of Sn(98.5)Ag(1.0) Cu(0.5) (SAC105), Sn(97.5)Ag(2.0)Cu(0.5) (SAC205), Sn(96.5)Ag(3.0)Cu(0.5) (SAC305) and Sn(95.5)Ag(4.0)Cu(0.5) (SAC405) solder alloys with Pb term
Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, milit
At the time the European Union RoHS deadline was enacted in July 2006, the industry practically had reached consensus on the use of near-eutectic Sn-Ag-Cu (SAC) solder alloys.
Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components.
This paper presents a thermal analysis of an integrated boost converter module by the finite element method.
We focus this paper on the improvement of the thermal management of power transistor based on the InGaP/GaAs HBT technology and specially for pulsed mode application.
Enhancing power efficiency and bandwidth of RF power amplifiers (PAs) is always a challenge for future mobile basestation transceivers.
This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process.
