Publications

DSC, TGA and DMA thermal analysis techniques are used to characterize a complex adhesive blend. The chemical and thermomechanical property development shown to follow a two-stage process.

The performance of the solar heating system incorporated in a Southwestern Bell service operating center in Oklahoma city is evaluated.

Dilatometry, high temperature x-ray diffraction, differential thermal analysis and differential scanning calorimetry have been performed on LaGaO sub 3 , LaAlO sub 3 , YAlO sub 3, SmAlO sub 3 , NdG

Dilatometry, high temperature x-ray diffraction, differential thermal analysis and differential scanning calorimetry have been performed on LaGaO sub 3, LaAlO sub 3, SmAlO sub 3, NdGaO sub 3, and P

The reliability of the soldier joints in surface mount constructions is an ongoing concern.

A necessary component in realizing the potential of integrated circuit technology is the substrate upon which the integrated circuit chip is mounted.

We measured thermal conductivity kappa, thermoelectric power S, ana electric conductivity a of La5/8-xPrxCa3/8MnO3, showing an intricate interplay between metallic ferromagnetism (FM) and charge or

This paper seeks to demonstrate the performance of a thermoelectric energy recovery module (TERM).

This paper seeks to demonstrate the performance of a thermoelectric energy recovery module (TERM).

Changes in the electronic properties of bulk GaAs crystals, grown from melts of varied As:Ga ratios, and Si-donor concentrations, were investigated by annealing in the temperature range 850C to 1