Single layers of 0.5microns thick epitaxial In sub (u) Ga sub (1-u) As sub (1-v) P sub (v) (.525 u .629 and .036 v .154) were grown on (100) InP substrate by Liquid Phase Epitaxy (LPE) techniqu
The effect of thermal stress during zone-melting recrystallization of silicon on insulator films is considered. New experimental results from graphite-strip heated films are drawn upon.
1. INTRODUCTION: The thermal characteristics of a Hybrid Integrated Circuit (HIC) were studied.
A simple analytical model is developed for the prediction of the thermally induced interfacial stresses in a polymer coated glass fiber with a low modulus coating at the ends.
A polymer-coated glass fiber with a low-modulus coating at the ends is considered.
Simple physically meaningful analytical (mathematical) predictive stress models are developed for typical through-silicon-via (TSV) designs using theory-of-elasticity approach.
Large temperatures gradients and substantial differences in thermal expansion coefficients are among the major factors for thermal stress generation in many materials systems.
Differential Scanning Calorimetry (DSC) measurements were performed on a series of ethylene-vinyl chloride copolymers (E-V) prepared via reductive dechlorination of poly(vinyl chloride) with tribut
Differential Scanning Calorimetry (DSC) measurements were performed on a series of ethylene-vinyl chloride (E-V) copolymers for the purpose of studying the dependence of their thermal transitions u
The thermal motion of the atoms in Ba sub 2 YCu sub 3 O sub 7 was recently using X-ray diffraction.
