Publications

This paper reports results on FEM modeling in order to calculate stress distribution at the Cu/Si boundary of TSVs after the fabrication process (annealing) using ANSYS software.

Precise thermomechanical positioning has been demonstrated in an actuator device based on a silicone elastomer with a high thermal expansion coefficient.

Density, surface tension and viscosity were measured in a LiCaAlF sub 6 melt from 815degrees to 915C.

An isotropic temperature-dependent potential (ITDP) is calculated For the description of binary interactions in gaseous tetramethylmethane, C(CH3)(4), and tetramethylsilane, Si(CH3)(4).

We study Coulomb blockade oscillations of thermoelectric coefficients of a single electron transistor based on a quantum dot strongly coupled to one of the leads by a quantum point contact.

We study Coulomb blockade oscillations of thermoelectric coefficients of a single electron transistor based on a quantum dot strongly coupled to one of the leads by a quantum point contact.

Phase separation behavior and phase morphology of mixtures of methylene dianiline (MDA)-cured diglycidyl ether of Bisphenol A (DGEBA) epoxy oligomer and 0-30 wt % of ethylene-(vinyl acetate) copoly

The use of organometallic vapor phase epitaxy (OMVPE) for the growth of Hg containing semiconductors has been hindered by lack of reproducibility and uniformity.

A study was undertaken to evaluate the thermosonic gold-wire bonding capability to Ti-Pd-Cu-Ni-Au thin film metallization on newly developed polymer hybrid integrated circuits (POLYHICs).

A study was undertaken to evaluate the thermosonic gold-wire bonding capability to Ti-Pd-Cu-Ni-Au thin film metallization on newly developed polymer hybrid integrated circuits (POLYHICs).