Evaluation of four candidate materials for packaging of microelectronic devices.

The rheology of four molding compound candidates for the packaging of microelectronic devices was measured. The relevant shear rates and temperatures were first determined to set the limits of the experiments and to determine where the results could be applied. Several engineering analyses were developed and employed to compare the merits of the candidate materials and to develop mold design aids from the results. The findings indicate that there are significant differences among the four materials. The rheology of Hysol 30F indicated less flow-induced stresses on the device than the other three materials.