Evaluation of polyimide as a dielectric for multichip packaging.

A condensation polyimide was evaluated to determine the effects of curing at different temperatures on chemical, electrical and physical properties. The chemical behavior of Du Pont PI- 2555 was examined using thermal analysis, Fourier transform infrared spectroscopy (FTIR) and pyrolysis gas chromatography/mass spectrometry (GC/MS). Electrical properties based on capacitance measurements taken at 10 sup 1 - 10 sup 6 Hz were also obtained. Adhesive strength was evaluated by using a peel test.