Evaluation of polyimides as dielectric materials for HICs with crossover/multilevel structure.
04 June 1984
Using Temperature-Humidity-Bias (THB) screening test, nine commercial polyimides were evaluated as dielectric materials for HICs (hybrid integrated circuits) with crossover or multilevel structure. Among these polyimides, DuPont PI2555 performed best. Under the THB test conditions (85degrees C/85%RH/180 Volts DC bias over 3 mils spacing), a slow increase of leakage current was observed on the TiPdAu triple track test samples coated with PI2555.