Feasibility Study of Using Machine Vision to Inpsect the Backside of Beam Leaded Integrated Circuit Chips

This thesis details the work done to prove the feasibility of using machine vision to inspect the back or inactive side of beam leaded integrated circuits prior to bonding them into packages. A description of beam leaded devices and the defects to be detected are presented. One of the driving forces for trying to automate the visual inspection process is to eliminate the human subjectivity from the manual inspection procedures.