FLIP-CHIP ASSEMBLY DESIGN OF AN ELECTRO-ABSORPTION MODULATED LASER BASED ON EM/CIRCUIT COMODELING

We designed two kinds of flip-chip bonded electro-absorption modulated laser on AlN or Si carrier, working at 100 Gb s?1. A theoretical comodeling approach based on 3D electromagnetic and circuit simulations has been applied and validated by measurements. As demonstrated, integration and behavior of future complex opto-electronic modules could be optimized applying such EM-based approach.A