Functional cycling and surface mounting attachment reliability.

A first-order reliability assessment model for surface mount solder joints is presented which in relatively simple and useful terms is capable of: (1) fatigue life predictions and reliability estimates, (2) parametric analysis, (3) normalization of test results at different temperature/frequency conditions to service conditions, (4) assessment of second-order effects in conjunction with empirical results, and (5) design of experimental test programs. The model is presented with all the underlying considerations necessary for its development, with detailed descriptions of the correlation steps for empirical results and a reliability design example. This tutorial paper will be presented at the ISHM Surface Mount Technology Seminar, Dallas, Texas, September 17 - 19, 1984.