III-V/SOI as a versatile platform for innovative hybrid lasers: from fast tunable lasers to multimode DFB comb-source lasers
02 July 2023
We present a III-V/SOI platform using wafer-bonding which allows integration of lasers. We demonstrated new lasers leveraging innovations this platform provides: nanosecond wavelength tuning laser, 10GHz-frequency continuous tuning DFB laser and a new few mode-locking laser.